LMTLF9UBH302W【PDF 6/9 页】2 FUNCTIONS, 50 V, 0.4 A, DATA LINE FILT

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co0304_reli-RP2

co0304_reli_e-01

This catalog contains the typical specication only due to the limitation of space. When you consider purchase of our products, please check our specication.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

10. Withstanding : between wires

CM-RA/BU-RA Type

No abnormality

CM-RB Type

TLF9U, TLF14CB

Test method and remarks

CM TLF : Applied voltage : 250VDC (CM-RA/BU-RA, CM-RB

: 2000VAC (TLF9UA, 14CB

: 500VDC (TLF9UB)

Duration : 60sec.

11. Withstanding : between wires and core

CM-RA/BU-RA Type

CM-RB Type

TLF9U, TLF14CB

No abnormality

Test method and remarks

TLF :

Applied voltage : 2000VAC (TLF9UA, 14CB)

: 500VDC (TLF9UB)

Duration

: 60sec.

13. Resistance to vibration

CM-RA/BU-RA Type

CM-RB Type

Appearance : No abnormality

Inductance change : Within

15%

TLF9U, TLF14CB

TLF9U : Inductance change : Within

TLF14CB : Within the specied range

Test method and remarks

CM TLF : According to JIS C 0040

Direction

: 2hrs each in X, Y and Z direction Total : 6hrs

Frequency range : 10 to 55 to 10Hz (1 min.)

Amplitude

: 1.5mm (shall not exceed acceleration 196m/s2)

Mounting method : soldering onto PC board

Recovery

: 2 to 24 hrs of recovery under the standard condition after the test. (CM-RB)

: At least 1hr of recovery under the standard condition after the removal from test chamber, followed by the measurement within 2hrs. (TLF9U, 14CB)

14. Solderability

CM-RA/BU-RA Type

At least 75% of terminal electrode is covered by new solder.

CM-RB Type

TLF9U, TLF14CB

Solder shall be uniformly adhered onto immersed surfaces.

Test method and remarks

CM :

Solder temperature : 235 5

Duration

: 2 0.5sec.

Immersion depth

: According to detailed specication.

TLF :

Solder temperature : 230 5

Duration

: 2 0.5sec. (9U)

: 3 0.5sec. (14CB)

Immersion depth

: Up to 1.0 to 1.5mm from PBC mounted level.

15. Resistance to soldering heat

CM-RA/BU-RA Type

Appearance : No abnormality

Inductance change : Refer to individual specication

CM-RB Type

TLF9U, TLF14CB

TLF9UA : Inductance change : Within

TLF14CB : Within the specied range

Test method and remarks

CM :

Solder temperature : 260 5

Duration

: 5 0.5sec.

Immersion depth

: Up to 2 2.5mm from terminal root.

Recovery

: 1 to 2 hrs of recovery under the standard condition after the test.

TLF :

Solder temperature : 260 5

Duration

: 10 1sec. (9U, 14CB)

Immersion depth

: Up to 1.0 to 1.5mm from PBC mounted level.

Recovery

: At least 1hr of recovery under the standard condition after the removal from test chamber, followed by the measurement within 2hrs.

12. Rated voltage

CM-RA/BU-RA Type

Within the specied range

CM-RB Type

TLF9U, TLF14CB

Test method and remarks

TLF9UA, 14CB

: 250VAC

TLF9UB

: 50VDC

RELIABILITY DATA

9. Insulation resistance between wire and core

CM-RA/BU-RA Type

CM-RB Type

TLF9U, TLF14CB

100M

min.

Test method and remarks

TLF : Applied voltage : 500VDC (TLF9UA, 14CB)

: 250VDC (TLF9UB)

Duration : 60 sec.

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